| 摘要 |
PURPOSE:To obtain the titled resin useful for sealing electronic parts such as semiconductor elements by removing chlorine from a chlorine-containing epoxy resin without detriment to the epoxy groups, by bringing the resin dissolved in a nonhalogenated inert solvent into contact with a specified dechlorinating agent and a radical generator and subjecting the mixture to solid/liquid separation. CONSTITUTION:A chlorine-containing epoxy resin (A) dissolved in a nonhalogenated inert solvent such as toluene to form a solution of a concentration of 5-80% is brought into contact with a dechlorinating agent (B) containing 2-60% (in terms of tin) tin compound of formula I or II [wherein R<1-5> are each a 1-12C alkyl, (substituted) aryl or (substituted) aralkyl] carried by a support polymer insoluble in the above solvent, such as a gel polymer formed by reacting, e.g., a copolymer of a vinyl monomer with a divinyl monomer such as divinylbenzine with a crosslinking agent (component B being used in an amount of 0.2-50mol of tin per mol of the chlorine of component A) and a radical generator (C) at room temperature to 180 deg.C to remove chlorine from component A. The mixture is subjected to solid/liquid separation to separate component A from component B.
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