| 摘要 |
PURPOSE:To enhance test reliability without reducing memory capacity and to improve bonding strength by a method wherein a coating formed on a chip after wire bonding is caused to serve as a protecting film. CONSTITUTION:A memory cell 2 is first installed on an IC substrate 1 wherein a wiring has been printed. The memory cell 2 and said printed wiring are bonded to each other with a gold wire 3. A clear coating 5 is formed, composed of resin permeable to ultraviolet rays, on the outer surface of the memory cell 2 and gold wire 3 installed on the IC substrate 1. Then, test data are written into the memory cell 2 for the performance of a prescribed function test. Said test data are deleted from the memory cell 2 upon judgment that the memory cell 2 is acceptable. By a method wherein a memory cell 2 is subjected to a function test after the memory cell 2 and gold wire 3 are provided with the clear coating 5 composed of resin permeable to ultraviolet rays, the memory cell 2 and others are protected against contamination by the test atmosphere. The strength of wire-bonding is also increased. |
