发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable an accurate positioning to be performed and increase the efficiency of the automatic mounting of a molded resin by integrally forming positioning projection members with a lead frame such that the members are projected from two side surfaces of the molded resin, said surfaces having no outer lead exposed outside. CONSTITUTION:Projection members 8 and 9 integrally formed with the island portion 10 of a lead frame are perpendicularly projected outward from the two side surfaces 4 and 7 of a molded resin 1 for sealing the lead frame therein, said molded resin 1 having the plan view of an approximately tetragonal configuration and said two side surfaces having none of such an outer lead as those 2a-2n and 3a-3n. The outside projection lengths of the projection members 8 and 9 are larger than the maximum length of expected burrs and adapted for the molded resin 1 to be held by an automatic mounting device. The projection members 8 and 9 are held by the automatic mounting device and a positioning is performed on the basis of the distance between the member 8 and the lead 2a.
申请公布号 JPS61251160(A) 申请公布日期 1986.11.08
申请号 JP19850092864 申请日期 1985.04.30
申请人 TOSHIBA CORP 发明人 DOBASHI KOJI
分类号 H01L23/50;H01L23/495;H05K3/30;H05K3/34 主分类号 H01L23/50
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