| 摘要 |
PURPOSE:To eliminate a warp of a semiconductor device and, at the same time, improve the productivity by a method wherein a lead frame and an aluminum radiation fin are isolated from each other and sealed with a sealing resin which has a linear thermal expansion coefficient similar to that of the fin. CONSTITUTION:A semiconductor element 1 is mounted on a lead frame 2 made of copper with nickel plating on the surface and a radiation fin 4 made of aluminum or aluminum alloy is provided with a predetermined spacing from the lead frame 2. The lead frame 2 and the fin 4 are electrically isolated from each other with an epoxy resin 3 which has a linear thermal expansion coefficient similar to that of the fin 4 and, at the same time, the frame 2 and the element 1 are sealed with the resin 3. The fin 4 is fitted to the aluminum heat sink 5 by a fixing means such as a screw 7. |
