| 摘要 |
<p>PURPOSE:To facilitate a high-speed and high-density mounting by bending the connection parts with IC chips and the connection parts to pads of a multilayer insulator so as to receive preliminary tensions. CONSTITUTION:The connection parts with respective LSI chips 4 of a flexible printed circuit 3 made of polyimide which has a low specific inductive capacity are vertically bent so as to receive preliminally tensions to form elastic beam parts 6. The connection parts to the pads of a super multilayer ceramic substrate 1 which has a high specific inductive capacity are also bent vertically so as to receive preliminary tensions to form elastic beam parts. With this constitution, signals can be made to travel on the flexible circuit 3 where the high-speed driving is required so that a high speed and high density mounting is facilitated.</p> |
