| 摘要 |
PURPOSE:To increase cycle life by bonding tin on the surface of a cathode grid comprising antimony-free lead alloy. CONSTITUTION:Sn is bonded on the surface of a grid comprising practically Sb-free Pb alloy, for example Pb-Ca alloy, then paste filling, acid impregnation, aging, and drying are performed to prepare a non-formed cathode plate. When initial charge for formation is applied, by the existence of Sn on the surface of the cathode grid, alpha-PbO2 preferentially produced on the interface of the cathode grid and active material. This prevents formation of a dense PbSO4 layer on the interface in deep charge-discharge. Therefore, capacity deterioration in an early stage can be prevented. |
