| 摘要 |
PURPOSE:To obtain a resin composition of high performance in heat and solvent resistance and molding processability, suitable for mechanical parts, communi cation/electronic device parts, etc., by incorporating polycarbonate resin with specified amount of specific maleimide resin highly compatible with said resin. CONSTITUTION:The objective resin composition can be obtained by blending (A) 5-80(pref. 10-70)wt% of a polymer with a melt flow index >=1 (pref. 2-10) prepared from A1: 15-95wt% of an aromatic vinyl compound of formula I (R<1> and R<2> are each 1-6C alkyl, etc.; R<3>-R<6> are each chloro, bromo, etc.) (e.g., styrene), A2: 70-5wt% of a maleimide compound of formula II (R<7> is H, alkyl, etc.; R<8> is H, vinyl, etc.; R<9> is H, lower alkyl, etc.) (e.g., N-phenyl maleimide), and A3: 0-60wt% of another copolymerizable monomer (e.g., maleic anhydride) and (B) 95-20(pref. 90-30)wt% of polycarbonate so as to represent >=1wt% in the amount of the component A2 in the final composition. |
