| 摘要 |
PURPOSE:To eliminate the variance in the copper deposition onto a bead wire by measuring the copper deposition on the bead wire during traveling between a copper plating cell and coiler and controlling the coiling speed of the coiler. CONSTITUTION:A steel wire 2 let off from a let-off reel 1 is passed through a hydrochloric tank 3 and a washing tank 4 and is plated with copper in a copper cladding bath cell 5. The wire is then passed through washing tanks 6, 7 and a hot washing tank 8 and is dried with a dryer 9. The deposition of the copper plated on the steel wire is measured by an energy dispersion type X-ray fluorometer 12 and the speed of the wire 2 is detected by a speed detector 15, then the relation between the plating speed and deposition of the steel wire is calculated at the speed at which the target deposition is attained by a microcomputer 13 so as to attain the target deposition. The result is fed back to a motor 14 for driving the coiling, by which the wire speed is controlled. The wire is thus plated with optimum copper deposition and the decreased variance thereof.
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