发明名称 Semiconductor component having an increased surface breakdown voltage
摘要 The surface breakdown voltage of planar semiconductor components can be increased by there being arranged, between the planar zones (3, 4) and the edge (7) of the semiconductor body, a field electrode (17) whose distance to the surface of the semiconductor body increases towards the edge. This is facilitated by the use of an insulating layer (6) which partly consists of a phosphorus silicate glass or a boron phosphorus silicate glass and has at least one flank (8) which rises towards the edge. <IMAGE>
申请公布号 DE3516222(A1) 申请公布日期 1986.11.06
申请号 DE19853516222 申请日期 1985.05.06
申请人 SIEMENS AG 发明人 FRANZ,GUENTHER,DR.;TIHANYI,JENOE,DR.
分类号 H01L23/29;H01L23/31;H01L23/532;(IPC1-7):H01L23/30;H01L29/58;H01L29/72;H01L29/78 主分类号 H01L23/29
代理机构 代理人
主权项
地址