| 摘要 |
PURPOSE:To enable thick film printing even when the surface of a printed circuit part has a stepped part, in a metal mask having at least one through- hole, by providing a stepped part to the surface of the metal mask. CONSTITUTION:A metal mask 1 has printed through-holes 2a, 2b...2n are provided at the positions of patterns 5a, 5b...5n on the surface of a printed circuit board 4 and the stepped part 6 is provided so as to correspond to the stepped part of the printed circuit board 4. The metal mask 1 is made of Fe, Cu, Al or an alloy. The printing of a pattern to the surface of the printed circuit loard 4 is performed by pressing a pasty printing material such as a conductive paste, for example, a solder paste, a ruthenium resistance paste, a dielectric paste or an adhesive into the printed through-holes 2a, 2b...2n by moving a squeezee 7. By providing the stepped part to the surface of the metal mask, printing can be applied to the printed circuit board having the stepped part. |
