| 摘要 |
Low-resistance and solderable printed conductors and contact surfaces are obtained by the initial application to an insulating substrate (10) of a first layer (11, 12, 13) of an electrically conductive coating which contains the following components: an adhesive binder, for example based on synthetic resins; electrically conductive particles in the form of carbon and/or metallic carbides and metal particles of a metal which in the electrochemical series of elements is less noble than a solderable metal. After curing of this first layer, the substrate with the first layer is brought into contact with a solution (for example by dipping or spraying) which contains ions of the solderable metal (e.g. copper, silver or gold), by which means a second layer (14, 15, 16) of the metal ions is applied to the first layer in a purely chemical way. <IMAGE>
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