| 摘要 |
PURPOSE:To facilitate a tight pressing at a sealing junction without breakage of a housing or a substrate by a method wherein an insert which has a linear thermal expansion coefficient larger or smaller than those of both the substrate and the housing frame is provided between touching surfaces of the substrate and the housing frame. CONSTITUTION:The inside surface at the end part of the frame 2 of a housing 4 and the end surface of a substrate 1 are made to face and touch each other and a ring shape insert 10 is provided between those touching surfaces and the insert 10 and the inside surface of the frame 2 and the insert 10 and the end surface of the substrate 1 are respectively joined with solder sheets 9. If the linear thermal expansion coefficient of the insert 10 is selected to be larger than those of both the frame 2 and the substrate 1, when the temperature at the junction rises, the solder is compressed between the touching surfaces of the frame 2 and the insert 10 and, when the temperature drops, the solder is compressed between the touching surfaces of the insert 10 and the substrate 1. If the linear thermal expansion coefficient of the insert 10 is smaller than those of both the frame 2 and the substrate 1, at the time of temperature rise and drop, the solder is compressed between the surfaces opposite to the above described. With this constitution, the sealing junction can be pressed tightly without breakage of the frame 2 and the substrate 1. |
