| 摘要 |
PURPOSE:To improve the efficiency of a soldering process by a method wherein both ends of a wire applied to an object are made to face the pads of a wiring pattern and those facing parts are pressed and held and; after the parts outside the pads are cut off, the two end parts of the wire are bonded and fixed to the object. CONSTITUTION:An end treatment apparatus 302 is driven to the direction of its access to a video head 1 and a pair of pads 1b are pressed by a pair of pressing shafts 307 with a wire 4 in between. When the apparatus 302 is driven further to the approaching direction, a pair of cutters 308 are pressed against the positions below the pads 1b and the parts of the wire 4 which come below the pads 1b are cut and removed. The tip of an adhesive nozzle 312 faces the lower position of a penetration hole 2a and sprays adhesive to bond the two ends of the wire 4 to the head 1. With this constitution, a soldering operation in a following process in which the two ends of the wire 4 are soldered to the pads can be facilitated.
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