| 摘要 |
PURPOSE:To preferably bond wires in high reliability by forming projections on a supporting base, disposing a pressing member at plane position different from the projections, and constructing to a slightly deflect leads when a lead frame is pressed by both. CONSTITUTION:A semiconductor structure 1 is moved on a heat block 4, stopped at the prescribed position, and when a heat block 4 is moved upward, a lead frame 3 is contacted with the ends of pressing pieces 24, 24a of a pressing member 14 on the upper surface, and interposed tightly between a lower plate 12 and the member 14. Leads 11 are contacted with a projection 18 and a plane projection 16 on the lower surface, and with the end of the piece 24 at the intermediate upper surface,and the leads 11 are interposed at the intermediate positions by the elastic force of the piece 24 by the contacting force in the slightly downwardly deflected state. Thus, even if irregular thickness or irregular surface flatness occurs between the leads 11, it is absorbed by the deflection of the leads, and the all leads are reliably supported. |
