| 摘要 |
<p>PURPOSE:To prevent the Sn component of lead-bonding solder from diffusing into an Ni compound by a method wherein electrodes to be installed on an Ni compound thin film is formed of Fe or its alloy. CONSTITUTION:On an Ni compound thin film 10, a pair of electrodes 18, 18 is provided for the sensor to output detected signals. A pair of Cu-made leads 14, 14 are attached to the electrodes 18, 18 by using Pb-Sn solder 16, 16 composed of 40wt% of Pb and 60wt% of Sn. The electrodes 18, 18 are composed of thin film of an Fe-containing metal to prevent the diffusion into the Ni compound thin film 10 of the Sn component of the solder 16, 16. The thin film electrodes 18, 18 may be composed of either an Fe alloy or pure Fe.</p> |
