| 摘要 |
<p>An epoxy resin composition comprising an epoxide compound, a guanidine compound, a filler, a thixotropic agent and an organic solvent and having a thixotropy index of 5 to 40 and a viscosity of 800 to 10,000 poises (at 20 DEG C.) is suitable for forming a resist film which is used in electroless metal plating with excellent heat resistance, solder resistance and corrosion resistance, and the like.</p> |
