| 摘要 |
PURPOSE:To enable to significantly improve the working efficiency of wire- bonding by a method wherein, when the wire-bonding is performed on a hybrid substrate with plural kinds of mounted semiconductor pellets, information on bonding of the pellets, which are memorized in advance in the same memory medium, are selected and a continuous bonding is performed based on the information. CONSTITUTION:Plural pellets, such as the first kind of an IC pellet 2 and the second kind of an IC pellet 3, and printed wirings 8 to be connected to these IC pellets 2 and 3 are mounted on a printed circuit substrate 1, this substrate 1 is housed in a square-type container 4 with the mutually opposed two sides 5 and 6, through which external leads 7 respectively pierce, and the substrate 1 is connected to the container 4 using wires (a). In this constitution, information on the bonding positions of the pellets 2 and 3, the program of the bonding procedures, information on bonding of the wirings 8 and the leads 7 and so forth are memorized in the floppy disc and these are made to do self-teaching in the pellets, the wirings and the leads and a wire-bonding is performed on the substrate with the mounted pellets. By such a way, the wire-bonding can be performed at a higher speed and the working efficiency thereof is improved. |
