| 摘要 |
PURPOSE:To obtain a semiconductor device having preferable thermal resistance in semiconductor element characteristic and strong mechanical strength of external leads by forming the material of an island for placing a semiconductor element of a copper metal, and forming the material of the leads led externally with resin of iron metal. CONSTITUTION:An element placing unit 4 is formed of copper metal, a semiconductor element 6 is secured by a solder 5 thereon, and the electrode of the element and external leads 1 are connected by gold wirings 3. The leads 1 mounted on a printed board are formed of iron metal. Thus, since the leads 1 are formed of the iron metal, its bending strength is high, and even if bent to place on the board, it is not broken, and unintentionally bent in the manufacturing steps. Since the unit 4 is formed of copper metal, its heat sink characteristic is preferable. |
