发明名称 Parts-connecting apparatus using solder
摘要 An apparatus for connecting wiring patterns on a wiring board and leads of a parts to be mounted on the wiring board, via the solder provided between the leads and the patterns. The parts-connecting apparatus enables, especially, circuit elements of a high degree of, to be connected automatically with high reliability and accuracy by using solder through the steps of setting the wiring board in a predetermined position while pressing a surface thereof so as to remove the warp from the wiring board, fastening the leads of the part to the wiring patterns by a magnet provided on the lower surface of the wiring board, and heating the solder provided on the portions of the leads which are fastened to the wiring patterns.
申请公布号 US4620663(A) 申请公布日期 1986.11.04
申请号 US19850702740 申请日期 1985.02.19
申请人 HITACHI, LTD. 发明人 ODASHIMA, HITOSHI;SASAKI, HIDEAKI;KAZUI, SHINICHI;SHIONO, SHIGEO;ISSHIKI, OSAMU;KAWANA, TAKESHI
分类号 B23K1/005;B23K26/08;H05K3/30;H05K3/34;H05K13/00;H05K13/04;(IPC1-7):B23K37/04;B23K31/02 主分类号 B23K1/005
代理机构 代理人
主权项
地址