发明名称 |
Parts-connecting apparatus using solder |
摘要 |
An apparatus for connecting wiring patterns on a wiring board and leads of a parts to be mounted on the wiring board, via the solder provided between the leads and the patterns. The parts-connecting apparatus enables, especially, circuit elements of a high degree of, to be connected automatically with high reliability and accuracy by using solder through the steps of setting the wiring board in a predetermined position while pressing a surface thereof so as to remove the warp from the wiring board, fastening the leads of the part to the wiring patterns by a magnet provided on the lower surface of the wiring board, and heating the solder provided on the portions of the leads which are fastened to the wiring patterns.
|
申请公布号 |
US4620663(A) |
申请公布日期 |
1986.11.04 |
申请号 |
US19850702740 |
申请日期 |
1985.02.19 |
申请人 |
HITACHI, LTD. |
发明人 |
ODASHIMA, HITOSHI;SASAKI, HIDEAKI;KAZUI, SHINICHI;SHIONO, SHIGEO;ISSHIKI, OSAMU;KAWANA, TAKESHI |
分类号 |
B23K1/005;B23K26/08;H05K3/30;H05K3/34;H05K13/00;H05K13/04;(IPC1-7):B23K37/04;B23K31/02 |
主分类号 |
B23K1/005 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|