发明名称 INJECTION MOLD FOR IC
摘要 PURPOSE:To improve the injection efficiency to the second cavity and to alleviate the occurrence of noncharging of resin and voids by increasing the first cavity side sectional area of the second gate for charging resin from the first cavity to the second cavity wider than the second cavity side. CONSTITUTION:The sectional area S1 of the second gate 4 at the first cavity side is increased as compared with that S2 of the second cavity side (S1>S2). Thus, since the area S1 of the first cavity side is larger in the second gate 2, resin is charged to the second cavity 5 before the resin is considerably charged in the first cavity 3, the resin is smoothly charged to suppress the uncharging and voids. Further, cutting after injection molding is executed previously at the second cavity side 5, and the first cavity 3 side can be then readily cut.
申请公布号 JPS61247038(A) 申请公布日期 1986.11.04
申请号 JP19850087959 申请日期 1985.04.24
申请人 NEC CORP 发明人 AKASHI SHINICHI
分类号 H01L21/56;B29C45/27;B29C45/34;B29K105/20;B29L31/34 主分类号 H01L21/56
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