| 摘要 |
PURPOSE:To enable to rationally manufacture by using a package body of larger size, shortcircuiting pins by a conductive layer formed at the side of the body to electrically plate the pins, and then cutting the side. CONSTITUTION:A package body 1 of larger size than the conventional one is used, and a plurality of pins 2 are provided on a region except the vicinity of the side, i.e., the region designated by broken lines. A conductive layer is formed on the side 4 of the body 1, the pins 1 are electrically connected with the conductive layer to shortcircuit the pins 2. A semiconductor pellet is contained in the body, wirings are formed between the pellet and the pins, and a sealing member 3 is coated to protect. At this time, a shell member 3 is electrically connected through a metal member 5 with the conductive layer. Here, the pins 2 and the member 3 are electrically plated. At this time, when the conductive layer formed on the side of the body is used as a plated electrode, the pins 2 and the member 3 are readily electrically placed in the same steps. |
