发明名称 |
Method and apparatus for placing a hook-up wire on a mounting board |
摘要 |
Previously, hook-up wires were glued to a mounting board by means of spot gluing. As disclosed herein, the insulated hook-up wire is first continuously coated with a coating of hot-melt adhesive and is then placed on the mounting board and simultaneously bonded by means of a heated laying tip of an application tool, similar to a soldering bit. When passing through the laying tip, the hook-up wire is briefly heated, whereby the coating of hot-melt adhesive is melted. The insulating layer of the hook-up wire has a higher temperature stability and is thereby not altered. In the immediately following application of the hook-up wire to the mounting board, the hot-melt adhesive cools and connects the hook-up wire to the mounting board.
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申请公布号 |
US4620889(A) |
申请公布日期 |
1986.11.04 |
申请号 |
US19850708684 |
申请日期 |
1985.03.06 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
WINTER, RUDOLF;HORNER, ALBERT;LINDNER, ADALBERT |
分类号 |
H05K3/10;H05K3/38;H05K7/06;(IPC1-7):B32B31/12 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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