| 摘要 |
PURPOSE:The titled composition which has properties necessary for sealing semiconductor elements, can be stored in the form of a one-component composition, can be applied in sealing with a dispenser and is excellent in rapid curability, comprising a liquid epoxy resin, a filler and a specified curing agent. CONSTITUTION:A liquid epoxy resin (A) having Na<+> and Cl<-> ion contents <=20ppm, respectively, and a hydrolyzable chlorine content <=1ppm is mixed with 30-80wt% filler (e.g., alumina) of a Na<+> ion content <=200ppm and a Cl<-> ion content <=20ppm and 30-50 PHR powdered dihydrazide compound (C) having a hydantoin skeleton of formula I (wherein R is CH3 or formula II) as a curing agent having latent curability. Component C in the mixture is dispersed in the form of a powder.
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