| 摘要 |
PURPOSE:To prevent the production of a reject when a metallic thin film is formed on the surface of a substrate having difference in level, by measuring the shape of a film on the substrate and controlling conditions during the formation of a film in accordance with the measured results. CONSTITUTION:A thin film 23, 25 is formed on a substrate 21 having difference 22 in level, and the shape of the uneven part 23 is measured with a measuring means 11. The measured results are fed back through a circuit 12 to control conditions during the formation of a metallic thin film. The production of a reject is prevented, and thin films 23 having the same prescribed unevenness are obtd. |
