| 摘要 |
PURPOSE:To prevent a packaging failure by inspecting adherend or electronic parts at every sticking of the adherend or electronic parts. CONSTITUTION:A circuit board 17 is conveyed and is positioned on an X-Y table 18 in the case of sticking preliminarily, for example, solder paste, for sticking of the adherend or electronic parts to the position for adhering the electronic parts with a dispenser head 4 then sticking and brazing the electronic parts thereon. The table 18 is then moved to the underside of the head 4 and the packaging position is successively moved to the underside of the head 4 from the preliminarily programmed packaging position. The head 4 is thereupon moved downward to press a nozzle 8 to the packaging position. The solder paste 12 is stuck onto an electrode pattern 20 in this stage. The stage for inspecting the paste 12 is thereafter executed during, for example, the rising period of the head 4. The presence or absence of the paste 12 is discriminated by projecting light from, for example, a light projector 14 and detecting the light reflected from the paste 12 by a photodetector 15.
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