| 摘要 |
PURPOSE:To prevent the deterioration of the polyimide on a substrate, by using aluminum as a metal base material and directly forming a polyimide layer to the surface thereof. CONSTITUTION:In manufacturing a heat resistant substrate used in a printed wiring board, an aluminum base material or a base material of which the surface is covered with metal aluminum is used as a metal base material. Polyamide acid or polyimide varnish is directly applied to the surface of the metal base material and dried and cured to make it possible to directly form the polyimide layer on the metal base material. Because the deteroration of the polyimide layer is generated by the reaction of the copper (II) ion occurring from a copper base material and polyimide in the presence of oxygen, said deterioration is suppressed to a large extent when aluminum is used. |
