| 摘要 |
PURPOSE:To realize low-noise and high-impedance features by a method wherein an IC package with pins protruding from one surface is put together with another IC package with pins protruding from the opposite surface and the two packages, facing each other and located near to each other, are connected to an input circuit. CONSTITUTION:An IC package 4 with a plurality of pins 3 protruding from both sides of the main body 1 in the direction a side 2 faces is put together with another IC package 4 with a plurality of pins 3 protruding from both sides of the main body 1 in the direction a side 5 faces. The input pins 2, 3 of the IC package 4 and of the IC package 6 are caused to face each other when they are connected to the input circuit so that the input pins 2, 3 may be positioned nearest to each other when they are installed in an input circuit. All the input pins 2, 3 are therefore to be equally affected by external noises, which means that any external noises if present will be neutralized to exert no apparent influence. |
