| 摘要 |
PURPOSE:To prevent the tipping of wafers and the swell of the wafer boat by a method wherein, in a wafer transferring tool provided with the holding grooves, wherein each wafer is vertically held, the wafers are held in such a way that the height of some wafers to be held differs from that of the other wafers to be held. CONSTITUTION:The lower half parts 4 and 4 of holding plates 1l and 1r are formed thicker, and at the same time, the surfaces 5 and 5 of the inner sides of the holding plates 1l are 1r are curved in an arc shape and concave upwardly in such a way as to approach nearer inside as going down to the lower side. A wafer transferring tool 3 holds semiconductor wafers 6 thereon, for example, in such a way that the height of the semiconductor wafers 6, 6... to be held in the holding grooves 7a, 7a... having odd numbers from the front side differs from that of the semiconductor wafers 6, 6... to be held in holding grooves 7b, 7b... having even numbers from the front side and the height of the semiconductor wafers to be held in the holding grooves odd numbers is made higher than that of the semiconductor wafers to be held in the holding grooves even numbers. The state of the semiconductor wafers is made to change from the held state to the opened state, the semiconductor wafers are made to somewhat lower over the wafer boat and when the wafers are brought into the placed state over the wafer boat, firstly the semiconductor wafers to be held lower in the holding grooves odd numbers fall on the wafer boat, then the semiconductor wafers to be held higher fall on the wafer boat.
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