| 摘要 |
PURPOSE:To provide an epoxy resin compsn. which does not cause cracking when used in sealing semiconductor elements, by blending fused quartz powder having specified properties and antimony trioxide with a phenol/curable epoxy resin compsn. CONSTITUTION:100pts.wt. phenol/curable epoxy resin compsn. (A) (e.g. compsn. consisting of a cresol novolak type epoxy resin and a phenolic novolak), 150-350pts.wt. fused quartz powder (B) (e.g. synthetic quartz powder) having such a particle size distribution that at least 90wt% of the powder is composed of particles having a particle size of 20mum or below and at least 85wt% thereof is composed of particles having a particle size of 1mum or above, and 1-50pts.wt. antimony trioxide (C) which has an average particle size of 10mum or below and in which extracted water has an electrical conductivity of 10muOMEGA<-1>/cm or below and the quantity of extracted chlorine ion is 5ppm, are mixed together to obtain an epoxy resin compsn. for use in sealing semiconductor elements.
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