Method for producing printed-circuit boards

摘要

A method for producing multilayer printed-circuit boards by pressing rigid and/or flexible individual layers, in the case of which continuous slots are incorporated in uncoated blank material, and a flexible or rigid layer, containing conductor layer material, is then pressed over the entire surface of the blank material on one side of said blank material. At the same time, conductor material without a carrier is pressed on the other side of the uncoated blank material.