| 摘要 |
PURPOSE:To reinforce the connection between bump electrodes while having no unfavorable effect on element characteristics by a method wherein a film with bump electrodes of the same shape as that of semiconductor elements aligned with those of the latter on both sides thereof is laid between said semiconductor elements. CONSTITUTION:Bump electrodes B3, B4 formed on both sides of a film 3 are laid between bump electrodes B1 on a chip 1 and the other bump electrodes B2 on another chip 2 to bond the bump electrodes B1 to the other bump electrodes B3 as well as the bump electrodes B2 to the other electrodes B4. Both bump electrodes B3, B4 are made of indium similar to the bump electrodes B1, B2 with their ends formed into conical shape. Besides, the film 3 is made of extremely thin sheet for print substrate of electric equipments. When the bump electrodes B1 are bonded to the bump electrodes B2 holding the film 3 with conical bump electrodes B3, B4, the bump electrodes B1 and the other electrodes B2 can be bonded very well to one another even if under low pressure due to the film 3 with conical bump electrodes B3, B4 filling the role of level adjusters. |
