发明名称 Method of fabricating thick film electrical components
摘要 A method is disclosed for fabricating thick film electrical components which are exceptionally uniform in electrical properties and have increased density wherein a thick film ink comprised of (i) an organic vehicle which is reactive with a plasma to form gaseous reaction products at a temperature below its thermal decomposition temperature, (ii) a glass frit having a glass transition temperature above the thermal degradation temperature, and (iii) a particulate material having the desired electrical properties for the thick film electrical component are applied to a suitable substrate in a pattern corresponding to the electrical component. The applied layer is then subjected to a suitable plasma at a temperature below the thermal degradation temperature for a time sufficient to remove the organic vehicle from the applied layer. The resultant layer is then heated at or above the glass transition temperature of the glass frit until the glass frit fuses and forms a composite with the particulate material.
申请公布号 US4619836(A) 申请公布日期 1986.10.28
申请号 US19850815076 申请日期 1985.12.31
申请人 RCA CORPORATION 发明人 PRABHU, ASHOK N.;CONLON, EDWARD J.;SECHI, FRANCO N.
分类号 H01L21/70;H05K1/09;H05K3/12;(IPC1-7):H05K3/12 主分类号 H01L21/70
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