Deep-grid semiconductor device

摘要

A semiconductor device has a deep control grid. A silicon substrate is grooved. The side walls and the bottom of the grooves are oxidized. Under the bottom of the grooves a dopant is implanted and diffused. A main metalization covering the grooved face makes a contact with the surface thereof and the parts of this metalization falling in the grooves does not cause any parasitic effect as the walls and the bottom of the grooves are insulated.