| 摘要 |
PURPOSE:To enable to adopt a faceup structure for a semiconductor device without damaging the heat-radiating characteristic of the device and to increase the number of the pins by a method wherein a member having an elasticity is mounted on the back surface of the metal cap and the surface of the semiconductor element is pressed by the member. CONSTITUTION:A silicone rubber 14 having a comparatively better thermal conductivity is adhered on the center part of the back surface of a metal cap 13. The cap 13 is airtightly sealed in a substrate 1 through seal rings 15. If so, the rubber 14 is brought into a state pressing a semiconductor element 4 and the heat to generate from the surface of the element 4 is efficiently trans mitted to the cap 13 and is radiated in the air. In this way, a faceup structure can be adopted for the semiconductor device without damaging the heat- radiating characteristic and the number of the pins can be increased. |
