发明名称 WIRE BONDING APPARATUS
摘要 PURPOSE:To perform the second bonding process with almost constant elastic load exerted by a method wherein, during the second bonding process, the second spring is connected with a bonding arm through the intermediary of an intermittent switching means to minimize the fluctuation in elastic load. CONSTITUTION:During the first bonding process connecting an element side electrode 8a with a metallic fine wire b led to a capillary 5, a solenoid 23 is made conductive attracting an adsorptive plate 26 fixed to a working rod 24 of the second spring 21b to disconnect a lever 10 from the second spring 21b. On the contrary, during the second bonding process connecting an externally leading electrode 8b with the metallic fine wire b, the solenoid 23 is not excited releasing the working rod 24 to bring the lever 10 into contact with the second spring 21b due to the elastic load of the spring 21 through the intermediary of the working rod 24 so that the capillary 5 may be actuated in combination with the elastic load of the first spring 21a through the intermediary of the lever 10 and a bonding arm 3.
申请公布号 JPS61242029(A) 申请公布日期 1986.10.28
申请号 JP19850083803 申请日期 1985.04.19
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YAMAMOTO AKIHIRO;MAKINO YUTAKA;INAGAKI NORIYUKI
分类号 H01L21/60 主分类号 H01L21/60
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