发明名称 Process for the deposition of metals on semiconductor powders
摘要 Copper, lead, mercury, tin, gold, silver, palladium, osmium and/or cadmium can be deposited by photoredox reaction on semiconductor sulfide powders by irradiating a suspension of semiconductor sulfide powder in the presence of oxygen and optionally CO2, of an oxidizable system which optionally protects the semiconductor from photocorrosion, and of a salt or complex of copper, lead, mercury, tin, gold, silver, palladium, osmium and/or cadmium.
申请公布号 US4619838(A) 申请公布日期 1986.10.28
申请号 US19850780158 申请日期 1985.09.26
申请人 CIBA-GEIGY CORPORATION 发明人 MEIER, KURT;BUEHLER, NIKLAUS;REBER, JEAN-FRANCOIS
分类号 C22B3/00;C22B3/44;C22B9/22;C22B15/00;C22B25/06;C22B43/00;C23C18/14;C23C18/16;(IPC1-7):B05D3/06 主分类号 C22B3/00
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