发明名称 LEADFRAME AND SEMICONDUCTOR DEVICE USING SAID LEADFRAME
摘要 PURPOSE:To ensure the fixing of a lead, by linking the tips of the leads by using synthetic resin. CONSTITUTION:An inner lead 4a is formed at a part of each lead 4, which is surrounded by a tie bar 5. The tips of the inner leads 4a are linked by polyimide resin 8. In a leadframe 1, etching is performed in a square sheet form, and a lead pattern is formed. Then the liquid-state polyimide resin is dropped by using an injector-shaped jig to the tips of the leads continuously from the back surface side of the leadframe 1. The polyimide resin 8 is solidified. At this time, the tip of each lead 4 is linked under the state that the surface side of the lead 4 is exposed to the outside and the tip is immersed in the polyimide resin 8. Even if ultrasonic wave vibration is applied, the leads are not vibrated, and the leads and wires can be rigidly bonded.
申请公布号 JPS61241953(A) 申请公布日期 1986.10.28
申请号 JP19850082467 申请日期 1985.04.19
申请人 HITACHI LTD 发明人 TANIMOTO MICHIO;OKAMOTO MICHIO
分类号 H01L23/50;H01L21/60;H01L23/495 主分类号 H01L23/50
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