发明名称 PLASMA TREATMENT APPARATUS
摘要 PURPOSE:To enable uniform, precise and efficient plasma treatment of an object to be treated by measuring the plasma intensity values at a plurality of points, and automatically controlling the magnetic field strength distribution along with the electric field strength of an electromagnetic wave such as microwave which are contributed to the plasma reaction. CONSTITUTION:The plasma intensities at A-point 28 and B-point 29 in a plasma chamber 1 are measured by a plasma intensity monitor (A) 30 and a plasma intensity monitor (B) 31. The measurement results are compared with the target plasma intensity distribution values set by treatment condition information 40, and the magnetic field strengths of an electromagnet (A) 22, electromagnet (B) 23 and electromagnet (C) 24 are controlled so that the plasma intensity values at the A-point 28 and the B-point 29 equal to the target values, thereby controlling the magnetic field strength distribution acting into the plasma chamber 1. Moreover, a strength control plate (A) 13 and a strength control plate (B) 14 are provided with positional control by a positional control motor (A) 15 and a positional control motor (B) 16, thereby controlling the application strength distributions of the microwaves to be applied from a microwave application port (A) 11 and a microwave application port (B) 12. With this, stable plasma reaction treatment with high precision and uniform quality is enabled.
申请公布号 JPS61241921(A) 申请公布日期 1986.10.28
申请号 JP19850082448 申请日期 1985.04.19
申请人 HITACHI LTD 发明人 AMADA HARUO
分类号 H01L21/205;H01L21/302;H01L21/3065;H01L21/31 主分类号 H01L21/205
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