| 摘要 |
PURPOSE:To form a bump in height having high precision by forming an insulating film so as to completely coat a conductive film on one main surface of an insulating substrate and shaping a predetermined opening section. CONSTITUTION:A conductive film 20 consisting of Cu, Ti/Pt, etc. is formed onto one main surface 10b except the periphery 10a of an edge section in a glass substrate 10 as an insulating substrate. The surface is coated with a positive type photo-resist, and a prescribed opening section is shaped through treatment, such as exposure, development, etc. A bump 50 is formed to the opening section through electroplating, the photo-resist is removed by acetone, etc., and the bump 50 is transferred to the nose section of an inner lead 70 for a film carrier 60 through thermocompression bonding. |
