| 摘要 |
PURPOSE:To prevent metal wirings from deforming by connecting metal wirings through a cutout with an electrode pad and internal leads, and supporting the metal wirings for connecting the internal leads with the pad by the cutout. CONSTITUTION:Internal leads 1 and an island 2 surrounded by the leads are integrally formed, and a semiconductor element 3 is bonded to the island 2 in the state of lead frames. When the electrode pad 7 of the element 3 and the lead 1 are connected therebetween by meal wirings 4, the wirings 4 are bonded through a cutout 6 formed at the internal leads. Accordingly, since the wirings 4 are supported at the end of the lead 1, its warpage is prevented to eliminate the contact with the element 3 and the island 2. The metal wirings are hardly deformed due to the vibration at transporting time and horizontal force of pressure at resin sealing time since supported laterally by the cutout 6, and the adjacent internal leads 1a and the metal wirings 4a are not contacted. |
