| 摘要 |
PURPOSE:To avoid the pollution of wafers by a method wherein, when a wafer vacuum-attracted to a vacuum chuck is rotary-coated with resist solution by a nozzle, a cleaning nozzle is mounted on the backside of wafer to scatter the resist solution creeping to the backside of wafer by cleaning solution. CONSTITUTION:A wafer 4 is vacuum-attracted to an opening 3 on the surface of a vacuum chuck 2 provided in a resist cup 1 and then while turning an axle 5 of the chuck 2 by a motor 6, resist solution 9 is dripped from a resist nozzle 9 positioned outside the cup 1 to be spread on overall surface of the wafer 4 by centrifugal force. In such a constitution, a cleaning nozzle 8 jetting cleaning solution within the range from the center to 20mm beyond the periphery of wafer 4 is mounted on the backside of wafer 4 extending to the peripheral parts of upper opening 3. The cleaning nozzle 8 sends up a jet of cleaning solution from a discharge pump not shown in figure to the backside through the intermediary of a valve 10 to scatter the resist solution 9 creeping in the backside so that the scattered resist solution may be discharged out of the cup 1 passing through discharge pipes 11 mounted the bottom of cup 1. |
