发明名称 MANUFACTURE OF COPPER ALLOY MATERIAL FOR LEAD FRAME
摘要 PURPOSE:To obtain a Cu alloy material for a lead frame having superior workability by soaking a Cu alloy ingot contg. small amounts of Ti, Ni and Sn and/or Cr under specified conditions, hot rolling the ingot, repeatedly cold rolling it while carrying out process annealing between the cold rolling stages, and subjecting the resulting material to finish annealing. CONSTITUTION:A Cu alloy ingot contg. small amounts of Ti, Ni and Sn and/or Cr is soaked at 850-950 deg.C and hot rolled. It is prepeatedly cold rolled while process annealing at 400-600 deg.C is carried out between the cold rolling stages, and the resulting material is subjected to finish annealing. The preferred composition of the Cu alloy consists of, by weight, 0.1-1% Ti, 0.1-2% Ni, 0.1-3% Sn and/or 0.1-1.5% Cr and the balance Cu.
申请公布号 JPS61238948(A) 申请公布日期 1986.10.24
申请号 JP19850078586 申请日期 1985.04.15
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 AKASAKA KIICHI;SHINOZAKI SHIGEO
分类号 H01L23/48;C22F1/00;C22F1/08;H01L23/495 主分类号 H01L23/48
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