| 摘要 |
<p>PURPOSE:To enable to cool semiconductor chips having favorable efficiency by a cooler of simple construction by a method wherein a top is made to come in contact with the chips mounted on a circuit substrate, and the top thereof is made to have a heat pipe construction. CONSTITUTION:Semiconductor chips 2 are mounted according to flip chip bonding on a circuit substrate 1, and a top 3 for heat dissipation is fitted as to cover nearly the whole surface of the substrate 1 coming in contact with the chips 2 thereof. Wicks 4 are formed inside of the top 3 thereof, and a heat transfer liquid is enclosed therein. The wicks 4 are formed by carving grooves of a large number on the base of the top 3, and the inside of the top 3 is divided into compartments 3a according to partitions 9 of the several number of pieces. Moreover, a heat exchanger 6 for heat dissipation is formed on the opposite side from the chips 2. Heat generated at the chips 2 is transmitted to the top 3. Thereupon the top 3 is utilized as a heat pipe, heat is transmitted to the exchanger 6, and dissipated to the outside from the exchanger 6.</p> |
