| 摘要 |
PURPOSE:To obtain a pattern high in density and precision by forming a photosensitive polyamide film on the whole surface of a printed circuit board having ruggedness and holes, patternwise exposing it, and developing off the nonexposed parts with an org. solvent, and at that time, utilizing cavitation generated with ultrasonic waves at a specified shock wave intensity for washing. CONSTITUTION:The photosensitive film is formed on the printed circuit board by coating the whole surface of the printed surface having various kinds of ruggedness or holes with a soln. of a photosensitive polyamide obtained by reacting ethyl 3,5-diaminobenzoate and (meth)acrylate and terephthaloyl chloride, and drying it. This film is patternwise exposed to harden the exposed parts, dipped it into the org. solvent to dissolve off the nonexposed parts, and at that time, shock wave pulses due to cavitation generated ultrasonic waves are applied so as to control their intensity to about 0.8-9N measured by a piezoelectric element, thus permitting the resin film to be perfectly removed from the nonexposed parts attached to the ruggedness and the holes and a pattern high in density and precision to be obtained without impairing the hardened parts in the development processing. |
