| 摘要 |
PURPOSE:To prevent the occurrece of dispersion in machining and to automate the processing, by supplying wafers one by one into a reaction chamber comprising a fixed bell jar and a wafer table which can be moved up and down, processing the wafers, and taking out the wafers one by one. CONSTITUTION:The wafer table 2 is lowered and the reaction chamber 11 is opened. Under this state, the wafers which are conveyed to the pickup position by a belt are sucked by a pickup 5 and placed on the table 2 by a driving mechanism 8. Then a cylinder 7 is actuated and the table 2 is lifted to contact with the bottom of the reacting chamber 11 airtightly. Thereafter the pressure is reduced and the plasma treatment is performed. After the treatment has completed and the pressure in the reacting chamber has been brought back to the normal pressure, the table 2 is lowered, a pickup 6 is operated, and the wafer is transferred from the table 2 to the belt 4a. In this method, the reacting part is miniaturized and the machining uniformity can be improved, conveying mechanism can be readily incorporated, and the continuous automation of the processing can be implemented. |
