发明名称 CURABLE RESIN COMPOSITION
摘要 <p>Thermosetting resin composition comprising a thermosetting cyanate ester resin composition (A) and a butadiene based copolymer (B) (i) or an epoxy resin-modified butadiene based copolymer (B) (ii), in which said component (B) (i) or (B) (ii) are used for modifying said component (A), component (A) and (B) being as follows; (A) a cyanate ester thermosetting resin composition comprising a cyanate ester compound selected from the group consisting of, (i) a polyfunctional cyanate ester having at least two cyanate group in its molecule, (ii) prepolymer of the cyanate ester of (i), (iii) coprepolymer of the cyanate ester of (i) and an amine, and (iv) mixtures thereof, and optionally adding another thermosetting resin, (B) (i) a butadiene based copolymer comprising a butadiene-aromatic vinyl monomer copolymer having 0.5 or more functional groups selected from a group consisting of carboxyl radical, hydroxyl radical, acid anhydride radical, mercapto radical, epoxy radical and amino radical, and a melting point of 10oC or more, in which 1,2-type content in butadiene structure of copolymer chain is 50% or more, (ii) an epoxy resin-modified butadiene based copolymer comprising said butadiene based copolymer (B) (i) having a carboxy radical modified with polyfunctional epoxy resin, and having a melting point of 10oC or more and an epoxy equivalent of 300-8,000.</p>
申请公布号 WO1986006085(A1) 申请公布日期 1986.10.23
申请号 JP1986000173 申请日期 1986.04.09
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