发明名称 |
SEMICONDUCTOR CHIP HOUSING |
摘要 |
A semiconductor chip housing provides hermetic sealing and appropriate electrical characteristics for use at high frequencies. The housing comprises a substrate in which the chip is mounted and a cylindrical tube having a top cover and extending above the substrate which impinges on a base and thus hermetically seals the chip. Microthin leads extend from the substrate periphery to the chip. The leads carrying high frequency signals have notches therein to compensate for the impedance introduced by the tube and to enable the microstrip to present a constant impedance at high frequencies throughout its length. |
申请公布号 |
GB8622404(D0) |
申请公布日期 |
1986.10.22 |
申请号 |
GB19860022404 |
申请日期 |
1986.09.17 |
申请人 |
INTERNATIONAL STANDARD ELECTRIC CORPORATION |
发明人 |
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分类号 |
H01L23/02;H01L23/10;H01L23/498;H01L23/66;(IPC1-7):H01L23/04 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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