| 摘要 |
PURPOSE:To provide the titled adhesive having high T-peel strength, curable without causing foaming and sagging and suitable for printed circuit board, etc., and composed of an epoxy resin, a petroleum resin, a curing agent, an inorganic filler having high thermal conductivity and an inorganic filler having low thermal conductivity. CONSTITUTION:The objective one-pack type adhesive can be produced by compounding (A) an epoxy resin with (B) a petroleum resin, (C) a curing agent, (D) an inorganic filler having high thermal conductivity (preferably having a thermal conductivity of >=0.01cal/cm.sec. deg.C) and (E) an inorganic filler having low thermal conductivity (e.g. clay, calcium carbonate, etc.). The ratio of the component B in the whole resin component (A+B) is preferably 10-30(wt)% and that of the component D in the whole inorganic filler (C+D) is preferably 20-80%.
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