发明名称 BONDING METHOD
摘要 PURPOSE:To enable the simple and quick boding and fixing of a pair of bonding members, preventing the electrical contact caused by the burr of steel plate, etc., by applying an adhesive mixed with insulating particles to the joining faces of the members to be bonded, joining the members, and heating and curing the adhesive by induction heating. CONSTITUTION:The joining faces 1a, 2a of the members 1, 2 to be bonded are coated with an adhesive 4 (e.g. two-pack type urethane adhesive) containing insulating particles 5 (e.g. glass beads) of a size to keep the bonding faces from direct contact. The adhesive 4 is cured by heating with induction heating to form a bonding layer 3.
申请公布号 JPS61236880(A) 申请公布日期 1986.10.22
申请号 JP19850077751 申请日期 1985.04.12
申请人 MITSUBISHI ELECTRIC CORP 发明人 ITO CHIAKI;TOMITA SADAHIRO;SHIMIZU KATSUNORI;SUGIYAMA ETSURO
分类号 C09J5/00;C09J5/06 主分类号 C09J5/00
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