| 摘要 |
PURPOSE:To relay internal connectors among a semiconductor chip and inner leads by relay electrode sections, and to shorten the internal connections by forming severally insulated relay electrode section at the peripheral end section of an island section, on which the semiconductor chip is loaded, an oppositely facing the relay electrode sections to the inner leads. CONSTITUTION:A film 4 is formed at the central section of the upper surface of an island section 2 in a lead frame 1, and a semiconductor chip 5 is loaded onto the film 4. Insulating films 8 are shaped at the peripheral end sections of the upper surface of the island section, and electrode layers 9 consisting of conductors as relay electrodes are formed onto the insulating films 9. The nose sections 3 of inner leads for the lead frame and respective electrode layer 9 are faced oppositely and arranged, and the chip 5 and the electrode layers 9 and the electrode layers 9a nd the films 4 formed onto the upper surfaces of the nose sections 3 of the inner leads are connected by wires 6 as internal connections, and sealed by a resin 7. Accordingly, the increase of pins for a semiconductor device can be attained without scaling up size. |
